Effects of grain boundaries on performance and hot-carrier reliability of excimer-laser annealed polycrystalline silicon thin film transistors
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1699504
Reference21 articles.
1. Effects of trap-state density reduction by plasma hydrogenation in low-temperature polysilicon TFT
2. Device Simulation of Grain Boundaries with Oxide-Silicon Interface Roughness in Laser-Crystallized Polycrystalline Silicon Thin-Film Transistors
3. Investigation of grain boundary control in the drain junction on laser-crystalized poly-Si thin film transistors
4. Dependence of polycrystalline silicon thin-film transistor characteristics on the grain-boundary location
5. Modeling and characterization of polycrystalline-silicon thin-film transistors with a channel-length comparable to a grain size
Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Hydrogenated n-Channel Low Temperature Polycrystalline Silicon TFTs as Ultraviolet Dosimeters;IEEE Journal of the Electron Devices Society;2021
2. Single-Grain Gate-All-Around Si Nanowire FET Using Low-Thermal-Budget Processes for Monolithic Three-Dimensional Integrated Circuits;Micromachines;2020-07-30
3. Impact of geometrical parameters on the electrical performance of network-channel polycrystalline silicon thin-film transistors;Japanese Journal of Applied Physics;2018-09-13
4. Influence of laser power on atom probe tomographic analysis of boron distribution in silicon;Ultramicroscopy;2017-02
5. Paper No 10.3: Bridged-Grain Polycrystalline Silicon Thin-Film Transistors;SID Symposium Digest of Technical Papers;2013-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3