Electromigration-induced drift in damascene and plasma-etched Al(Cu). I. Kinetics of Cu depletion in polycrystalline interconnects
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.371830
Reference40 articles.
1. Reduction of Electromigration in Aluminum Films by Copper Doping
2. Inhibition of Electromigration Damage in Thin Films
3. The effect of copper additions on electromigration in aluminum thin films
4. Segregation of copper in dilute aluminum - copper alloys
5. Kirkendall study of electromigration in thin films
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3. Investigation of the effects of He bubbles on the nucleation, growth and thermal stability of Al–Cu nanoprecipitates in ion implanted Al foils;Acta Materialia;2004-02
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