Electromigration reliability issues in dual-damascene Cu interconnections-Reference-Cited by-同舟云学术

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Electromigration reliability issues in dual-damascene Cu interconnections

Published:2002-12 Issue:4 Volume:51 Page:403-419
ISSN:0018-9529
Container-title:IEEE Transactions on Reliability
language:en
Short-container-title:IEEE Trans. Rel.

Author:

Ogawa E.T.,Ki-Don Lee ,Blaschke V.A.,Ho P.S.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality

Link

http://xplorestaging.ieee.org/ielx5/24/22383/01044338.pdf?arnumber=1044338

Cited by 205 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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4. Effects of molecular assembly on heterogeneous interactions in electronic and photovoltaic devices;Chemical Physics Reviews;2024-01-09

5. Understanding electromigration failure behaviors of narrow cobalt lines and the mechanism of reliability enhancement for extremely dilute alloying of manganese oxide;Journal of Alloys and Compounds;2024-01

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