Segregation of copper in dilute aluminum - copper alloys-Reference-Cited by-同舟云学术

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Segregation of copper in dilute aluminum - copper alloys

Published:1994-06 Issue:12 Volume:30 Page:1531-1534
ISSN:0956-716X
Container-title:Scripta Metallurgica et Materialia
language:en
Short-container-title:Scripta Metallurgica et Materialia

Author:

Small M.B.,Smith D.A.,Garratt-Reed A.J.

Publisher

Elsevier BV

Subject

General Engineering

Reference13 articles.

1. Reduction of Electromigration in Aluminum Films by Copper Doping

2. F.M. d.'.Heurle and P.S. Ho in Thin Films; Interdiffusion and Reactions, Ed. J.M. Poate and K.N. Tu (Wiley, New York) pg. 243

3. Inhibition of Electromigration Damage in Thin Films

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1. Effect of Electromigration-Induced Joule Heating on the Reliability of Sn-Ag Microbump with Different UBM Structures;Journal of Electronic Materials;2020-10-22

2. Segregation and Phase Transitions in Grain Boundaries;Diffusion Foundations;2019-05

3. Grain Boundary Diffusion. Effect of Segregation or Concentration Dependence of Diffusivity;Defect and Diffusion Forum;2012-04

4. Initial Studies of 6082 Aluminium Thin Films;ICAA13 Pittsburgh;2012

5. Cu GB Diffusion in Al. Effect of Alloying by Cu and Ce;Defect and Diffusion Forum;2011-03

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