Formation of intermetallic layer with multiwall carbon nanotubes reinforcement in Sn-0.7Cu solders on bare copper surface finish with laser soldering method
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Publisher
AIP Publishing
Link
http://aip.scitation.org/doi/pdf/10.1063/5.0083715
Reference5 articles.
1. Development of micro assembly processes for further miniaturization in electronics production
2. Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate
3. Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability
4. Single-wall carbon nanotube (SWCNT) functionalized Sn–Ag–Cu lead-free composite solders
5. Influence of thermal aging on microhardness and microstructure of Sn–0.3Ag–0.7Cu–xIn lead-free solders
Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Materials Modification of Lead-Free Solder Alloys with Different Reinforcing Components;Springer Proceedings in Physics;2023
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