Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference35 articles.
1. Lead-free solders in microelectronics;Abtew;Mater. Sci. Eng.,2000
2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology;Zeng;Mater. Sci. Eng.,2002
3. Creep behavior of the ternary 95.5Sn–3.9Ag–0.6Cu solder-Part I: As-cast condition;Vianco;J. Electron. Mater.,2004
4. Materials and processes for implementing high-temperature liquid interconnects;Mannan;IEEE Trans. Adv. Packaging,2004
5. Properties of lead-free solder alloys with rare earth element additions;Wu;Mater. Sci. Eng.,2004
Cited by 52 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Electrical Resistivity of Lead-Free Solders Reinforced by Carbon Nanospheres;International Journal of Thermophysics;2024-02-06
2. Low-Temperature Sinterable Cu@Ag Paste with Superior Strength Driven by Pre-Heating Process;Energies;2023-07-17
3. Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites;Applied Nanoscience;2023-07-07
4. Effect of indium on microstructure, mechanical properties, phase stability and atomic diffusion of Sn-0.7Cu solder: Experiments and first-principles calculations;Materials Science and Engineering: A;2022-10
5. Structure and properties of low-Ag SAC solders for electronic packaging;Journal of Materials Science: Materials in Electronics;2022-09-24
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3