1. Development of Specific Technologies and Assembly Systems for the New Challenge of Electro-optical Devices;Feldmann;CIRP Annals-Manufacturing Technology,2007
2. Technological Advancements in Lead-Free Wafer Bumping Using Stencil Printing Technology;Manessis;European Microelectronics and Packaging Conference,2005
3. Evaluation of Innovative Nano-Coated Stencils in Ultra-Fine-Pitch Flip Chip Bumping Processes;Manessis;IMAPS 2008 41st International Symposium on Microelectronics,2008
4. Development and Evaluation of Lead Free Reflow Soldering Techniques for the Flip Chip Bonding of Large GaAs Pixel Detectors on Si Readout Chip;Klein,2008
5. A New Process for Flip-Chip Interconnections With Variable Stand-Offs;Keßling,2008