Influence of thermal aging on microhardness and microstructure of Sn–0.3Ag–0.7Cu–xIn lead-free solders
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference20 articles.
1. Variable eutectic temperature caused by inhomogeneous solute distribution in Sn–Zn system
2. Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys
3. Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn–9Zn eutectic alloy
4. Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder
5. Effect of adding 1wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging
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1. Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint;Journal of Materials Science: Materials in Electronics;2024-01
2. Formation of intermetallic layer with multiwall carbon nanotubes reinforcement in Sn-0.7Cu solders on bare copper surface finish with laser soldering method;Special Issue of the 4th International Symposium on Advanced Materials and Nanotechnology (iSAMN 2020);2022
3. Influence of cooling conditions on microstructure and mechanical property of Sn-0.3Ag-0.7Cu lead-free solder;Journal of Metals, Materials and Minerals;2021-06-27
4. Influence of cooling conditions on microstructure and mechanical property of Sn-0.3Ag-0.7Cu lead-free solder;J MET MATER MINER;2021
5. Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys;Journal of Materials Science: Materials in Electronics;2020-08-01
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