Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn–9Zn eutectic alloy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference30 articles.
1. Progress in the design of new lead-free solder alloys
2. Lead-free Solders in Microelectronics
3. Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders
4. Heat Resistance of Sn–9Zn Solder/Cu Interface with or without Coating
5. In search of new lead-free electronic solders
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