Author:
Zernitsa D. A.,Shepelevich V. G.
Reference28 articles.
1. Islam, R.A., Wu, B., Alam, M., Chan, Y., and Jillek, W., Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder, J. Alloys Compd., 2005, vol. 392, nos. 1–2, pp. 149–158.
2. Huang, M.L., Hou, X.L., Kang, N., et al., Microstructure and interfacial reaction of Sn–Zn–x(Al, Ag) near-eutectic solders on Al and Cu substrates, J. Mater. Sci.: Mater Electron., 2014, vol. 25, pp. 2311–2319.
3. Chen, K.-I., Cheng, S.-C., Wu, S., and Lin, K.-L., Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn–9Zn eutectic alloy, J. Alloys Compd., 2006, vol. 416, nos. 1–2, pp. 98–105.
4. Das, S.K., Sharif, A., Chan, Y.C., Wong, N.B., and Yung, W.K.C., Alloys influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn–9Zn binary eutectic solder alloy, J. Alloys Compd., 2009, vol. 481, nos. 1–2, pp. 167–172.
5. Chuang, C.M., Lui, T.S., and Chen, L.H., Effect of aluminum addition on tensile properties of naturally aged Sn–9Zn eutectic solder, J. Mater. Sci., 2002, vol. 37, pp. 191–195.