Effect of electromigration-induced back stress gradient on nanoindentation marker movement in SnAgCu solder joints
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2397549
Reference9 articles.
1. Recent advances on electromigration in very-large-scale-integration of interconnects
2. Stress generation by electromigration
3. Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization
4. Electromigration of eutectic SnPb solder interconnects for flip chip technology
5. Electromigration in Pb-free flip chip solder joints on flexible substrates
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3. Shear performance of Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density;Journal of Materials Science: Materials in Electronics;2022-10-06
4. Shear performance of microscale ball grid array structure Sn–3.0Ag–0.5Cu solder joints with different surface finish combinations under electro-thermo-mechanical coupled loads;Journal of Materials Science: Materials in Electronics;2022-02-02
5. Abnormal Shear Performance of Microscale Ball Grid Array Structure Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints with Increasing Current Density;Crystals;2022-01-08
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