Ag particles for sinter bonding: Flakes or spheres?

Author:

Yeom Jeyun12,Nagao Shijo2ORCID,Chen Chuantong2,Sugahara Tohru2,Zhang Hao2,Choe Chanyang12,Li Cai-Fu2ORCID,Suganuma Katsuaki2

Affiliation:

1. Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University, Yamadaoka 2-1, Suita, Osaka 565-0871, Japan

2. The Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan

Funder

Advanced Low Carbon Technology Research and Development Program

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Reference23 articles.

Cited by 29 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging;Microelectronics Reliability;2024-01

2. Pressureless sinter-joining of micron-Ag flake pastes at 160 °C enabled by solvent and interface engineering;Journal of Materials Processing Technology;2023-12

3. Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components;Electronics;2023-07-27

4. High reliability design Ag sinter joining on softened Ni-P /Pt/Ag metallization substrate during harsh thermal cycling;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

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