High reliability design Ag sinter joining on softened Ni-P /Pt/Ag metallization substrate during harsh thermal cycling
Author:
Affiliation:
1. Osaka University,Flexible 3D System Integration Laboratory,Osaka,Japan
2. Osaka University,SANKEN,Osaka,Japan
3. Daicel Corporation,Osaka,Japan
4. C. Uyemura & Co., Ltd,Osaka,Japan
Funder
New Energy and Industrial Technology Development Organization NEDO
JSPS KAKENHI
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195524.pdf?arnumber=10195524
Reference12 articles.
1. Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules
2. Robust bonding and thermal-stable Ag–Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less
3. An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling
4. Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock
5. Reliability Evaluation of Multichip Phase-Leg IGBT Modules Using Pressureless Sintering of Nanosilver Paste by Power Cycling Tests
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