1. Chemical analysis of HfO2∕Si (100) film systems exposed to NH3 thermal processing
2. Y. T. Chen
,
J. Huang
,
J. Price
,
P. Lysaght
,
D. Veksler
,
C. Weiland
,
J. C. Woicik
,
G. Bersuker
,
R. Hill
,
J. Oh
,
P. D. Kirsch
,
R. Jammy
, and
J. C. Lee
, “
III–V gate stack interface improvement to enable high mobility 11 nm node CMOS,” in 2012 International Symposium on VLSI Technology, Systems, and Applications (VLSI-TSA) (2012), pp. 1–2.
3. J. Huang
,
N. Goel
,
P. Lysaght
,
D. Veksler
,
P. Nagaiah
,
S. Oktyabrsky
,
J. Price
,
H. Zhao
,
Y. T. Chen
,
J. C. Lee
,
J. C. Woicik
,
P. Majhi
,
P. D. Kirsch
, and
R. Jammy
, “
Detailed high-k/In0.53Ga0.47As interface understanding to enable improved In0.53Ga0.47As gate stack quality,” in 2011 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) (2011), pp. 1–2.
4. Band alignment of atomic layer deposited HfO2 on clean and N passivated germanium surfaces
5. Initiation of a passivated interface between hafnium oxide and In(Ga)As(0 0 1)−(4×2)