Crack Propagation Analysis in Laser Scribing of Glass
Author:
Publisher
Japan Laser Processing Society
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Instrumentation
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. High-Speed Laser Cutting Silicon-Glass Double Layer Wafer with Laser-Induced Thermal-Crack Propagation;Processes;2023-04-11
2. Study on Femtosecond Laser Stealth Cutting Technology of Quartz;2022 IEEE 13th International Conference on Mechanical and Intelligent Manufacturing Technologies (ICMIMT);2022-05-25
3. Use of inner-heated circular microwave spot to cut glass sheets based on thermal-controlled fracture method;Journal of Materials Processing Technology;2020-02
4. Investigation on the crack fracture mode and edge quality in laser dicing of glass-anisotropic silicon double-layer wafer;Journal of Materials Processing Technology;2020-01
5. Crafting interior holes on chemically strengthened thin glass based on ultrafast laser ablation and thermo-shock crack propagations;Sensors and Actuators A: Physical;2020-01
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