Investigation on the crack fracture mode and edge quality in laser dicing of glass-anisotropic silicon double-layer wafer-Reference-Cited by-同舟云学术

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Investigation on the crack fracture mode and edge quality in laser dicing of glass-anisotropic silicon double-layer wafer

Published:2020-01 Issue: Volume:275 Page:116356
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Zhao Chunyang,Cai Yecheng,Ding Ye,Yang Lijun,Wang Zhenlong,Wang Yang

Funder

National Key R&D Program of China

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference18 articles.

1. Laser cutting silicon-glass double layer wafer with laser induced thermal-crack propagation;Cai;Opt. Laser. Eng.,2016

2. Dynamic fracture in single crystal silicon;Hauch;Phys. Rev. Lett.,1999

3. Wafer level packaging of MEMS;Esashi;J. Micromech. Microeng.,2008

4. Tensors for physics;Hess,2015

5. Anodic bonding;Knowles;Int. Mater. Rev.,2006

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1. Chipping-induced fracture investigation of glass interposer with dielectric coatings;Surface and Coatings Technology;2024-08

2. Experimental and numerical study on thin silicon wafer CO2 laser cutting and damage investigation;The International Journal of Advanced Manufacturing Technology;2024-04-26

3. Process Analysis and Topography Evaluation for Monocrystalline Silicon Laser Cutting-Off;Micromachines;2023-07-31

4. Low-Temperature Gas Cooling Correction Trajectory Offset Technology of Laser-Induced Thermal Crack Propagation for Asymmetric Linear Cutting Glass;Processes;2023-05-15

5. High-Speed Laser Cutting Silicon-Glass Double Layer Wafer with Laser-Induced Thermal-Crack Propagation;Processes;2023-04-11

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