Author:
Knowles K. M.,van Helvoort A. T. J.
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference169 articles.
1. Field Assisted Glass‐Metal Sealing
2. Field Assisted Glass Sealing
3. Wafer-to-wafer bonding for microstructure formation
4. Q.Y. Tong and U. Gösele: ‘Semiconductor wafer bonding: science and technology’; 1999, New York, NY, The Electrochemical Society.
Cited by
119 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献