Author:
Wang Hailong,Wang Maolu,Zhang Hongzhi,Wang Yang
Funder
National Natural Science Funds of China
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites
Reference12 articles.
1. Experimental research of yag laser cutting soda-lime glass sheets with controlled fracture;Cai;Key Eng. Mater.,2010
2. Graham, C.E., Lumley, R.M., Oberholzer, D.J., 1971. Laser Substrate Parting. US, US3629545.
3. Laser-Induced Cleavage of LCD Glass as Full-Body Cutting. Laser-based Micro- and Nanopackaging and Assembly II (Vol. 6880). Laser-Based Micro- and Nanopackaging and Assembly II;Karube,2008
4. Effect of thermal stresses on chip-free diode laser cutting of glass;Nisar;Opt. Laser Technol.,2009
5. The effect of continuous and pulsed beam modes on cut path deviation in diode laser cutting of glass;Nisar;Int. J. Adv. Manuf. Technol.,2010
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