Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects-Reference-Cited by-同舟云学术

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Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects

Published:2008-01 Issue:14 Volume:22 Page:1733-1756
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Haase J.,Farley D.,Iyer P.,Baumgartner P.,Dasgupta A.,Caers J. F. J.

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883

Reference14 articles.

1. Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill

2. Evaluation of contact resistance for isotropic electrically conductive adhesives

3. Loken, L. 1994.Proc. NEPCON WEST632Anaheim, CA

4. Noise in conductive adhesive bonds under mechanical stress as a sensitive and fast diagnostic tool for reliability assessment

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Recent advances in mechanical properties of anisotropic conductive adhesive film for microelectronic packaging;Soldering & Surface Mount Technology;2015-09-07

2. Influence of fabrication parameters on bond strength of adhesively bonded flip-chip interconnects;Journal of Adhesion Science and Technology;2014-03-12

3. Mechanical Properties of Anisotropic Conductive Adhesive Film Under Hygrothermal Aging and Thermal Cycling;Journal of Electronic Materials;2012-03-16

4. Cold welding: A new factor governing the robustness of adhesively bonded flip-chip interconnects;2009 59th Electronic Components and Technology Conference;2009-05

5. Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-Conducting Adhesive Assemblies;Journal of Adhesion Science and Technology;2008-01

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