Influence of fabrication parameters on bond strength of adhesively bonded flip-chip interconnects-Reference-Cited by-同舟云学术

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Influence of fabrication parameters on bond strength of adhesively bonded flip-chip interconnects

Published:2014-03-12 Issue:12 Volume:28 Page:1167-1191
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Sinha K.,Farley D.,Kahnert T.,Solares S.D.,Dasgupta A.,Caers J.F.J.,Zhao X.J.

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883

Reference35 articles.

1. Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects

2. Two multichannel integrated circuits for neural recording and signal processing

3. Holm R. Electric contacts handbook. Berlin: Springer-Verlag; 1958. p. 433.

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1. Applications of fracture mechanics to quantitative accelerated life testing of plastic encapsulated microelectronics;Microelectronics Reliability;2018-01

2. Effect of the Ni/Pd/Au-Cu pre-plated finish lead frame surface structure treated by various surface roughening methods on packaging properties;Journal of Adhesion Science and Technology;2015-11-02

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