Author:
Evans John W.,Sinha Koustav
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference34 articles.
1. Area Array Interconnection Handbook;Puttlitz,2001
2. Polymer adhesives and encapsulants for microelectronic applications;Benson;Johns Hopkins APL Technical Digest,2008
3. Electronic Materials and Properties, Electronic Packaging Handbook;Evans,1991
4. Influence of temperature and humidity on adhesion of underfills for flip chip packaging;Luo;IEEE Transactions on Components and Packaging Technologies,2005
5. Understanding the strength of epoxy-polyimide interfaces for flip-chip packages;Hoontrakul;IEEE Transactions on Device and Materials Reliability,2003
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献