Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-Conducting Adhesive Assemblies-Reference-Cited by-同舟云学术

Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-Conducting Adhesive Assemblies

Published:2008-01 Issue:14 Volume:22 Page:1757-1780
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Farley D.,Dasgupta A.,Caers J. F. J.

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883

Reference28 articles.

1. Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects

2. Caers, J. F. J., Zhao, X. J., Wong, E. H., Ong, C. K., Wu, Z. X. and Ranjan, R. 2003.Proceedings of the 53rd IEEE Electronic Components and Technology Conference1176New Orleans, LA

3. Ferrando, F., Zeberli, J. F., Clot, P. and Chenuz, J. M. 2000.Proceedings of the 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing205Espoo, Finland

4. Li, L. and Treliant, F. 2000.Proceedings of the 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing129Espoo, Finland

5. Caers, J. F. J., Zhao, X. J., Sy, H. G., Wong, E. H. and Mhaisalkar, S. G.Proceedings of the 54th IEEE Electronic Components and Technology Conference106Las Vegas, NV

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