Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill-Reference-Cited by-同舟云学术

Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill

Published:1999-12 Issue:3 Volume:16 Page:6-14
ISSN:1356-5362
Container-title:Microelectronics International
language:en
Short-container-title:Microelectronics International

Author:

Zhong Zhaowei

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Beddingfield, C. (1997), “Effect of underfill materials and assembly processes on moisture sensitivity of flip chip assemblies”, Proceedings of the Technical Program, Surface Mount International, USA, pp. 298‐305.

2. Tomorrow’s Packaging – Chip Scale Packaging vs Flip Chip

3. Jimarez, M., Markovich, V. and Memis, I. (1997), “Surface laminar circuit printed wiring board and direct chip attach ‐ flip chip”, Proceedings of the Technical Program, Surface Mount International, USA, pp. 320‐24.

4. Johnson, R.W., Capote, M.A., Zhou, Z.M, Chu, S. and Zhou, L. (1997), “Reflow‐curable polymer fluxes for flip chip assembly”, Proceedings of the Technical Program, Surface Mount International, USA, pp. 267‐72.

5. Kloeser, J., Kutzner, K. and Gross, K. (1997), “A new production line for low cost flip chip assembly”, Proceedings of the Technical Program, Surface Mount International, USA, pp. 257‐66.

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