1. Zhong, Z. (1999), “Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill”, Microelectronics International, Vol. 16 No. 3, pp. 6–14.
2. Zhou Dejian, Huang Chunyue, Wu Zhaohua (2006), “SMT solder joints quality assurance based on solder joints virtual evolving technology”, Computer Integrated Manufacturing Systems, Vol.12, No.8, pp. 1267–1272. (in Chinese).
3. A. L. B. Candeias, L. V. Dutra, et al.(1995), “Interferogram phase noise reduction using morphological and modified median filters”, Proc.IGARSS, Vol.1, No.1, pp. 166–168.
4. Luca Brevegliei, Vincenzo Piuri (2002), “Digital Median Filters”, Journal of VLSI Signal Processing, Vol.31, No.3, pp. 191–206.
5. Toliyat H A, Abbaszadeh K, Rahimian M.M (2003), “Rail Defect Diagnosis Using Wavelet Packet Decomposition”, IEEE Transactions on Industry Applications, Vol.39, No.5, pp. 1454–1461.