Author:
Nenashev R. N.,Vishnevskiy A. S.,Kotova N. M.,Vorotilov K. A.
Subject
Materials Chemistry,Metals and Alloys,Inorganic Chemistry,General Chemical Engineering
Reference20 articles.
1. Baklanov, M.R., Ho, P.S., and Zschech, E., Advanced Interconnects for ULSI Technology, Chichester: Wiley, 2012.
2. Baklanov, M.R., Maex, K., and Green, M., Dielectric Films for Advanced Microelectronics, Chichester: Wiley, 2007.
3. Grill, A., Gates, S.M., Ryan, T.E., Nguyen, S.V., and Priyadarshini, D., Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—state of the art, Appl. Phys. Rev., 2014, vol. 1, no. 1, paper 011306.
4. Sugahara, S., Usami, K., and Matsumura, M., A proposed organic-silica film for inter-metal-dielectric application, Jpn. J. Appl. Phys., 1999, vol. 38, no. 3R, pp. 1428–1433.
5. Kim, B.R., Kang, J.W., and Lee, K.Y., Physical properties of low-k films based on the co-condensation of methyltrimethoxysilane with a bridged silsesquioxane, J. Mater. Sci., 2007, vol. 42, no. 12, pp. 4591–4602.
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献