Author:
Shepelevich V. G.,Zernitsa D. A.
Subject
General Engineering,General Materials Science
Reference30 articles.
1. El Basaty, A.B., Deghady, A.M., and Eid, E.A., Influence of small addition of antimony (Sb) on thermal behavior, microstructural and tensile properties of Sn–9.0Zn–0.5Al Pb-free solder alloy, Mater. Sci. Eng., A, 2017, vol. 701, pp. 245–253. https://doi.org/10.1016/j.msea.2017.06.092
2. Kechin, V.A. and Lyublinskii, E.Ya., Tsinkovye splavy (Zinc Alloys), Moscow: Metallurgiya, 1986.
3. Lee, J.E., Kim, K.S., Suganuma, K., Takenaka, J., and Hagio, K., Interfacial properties of Zn–Sn alloys as high temperature lead-free solder on Cu substrate, Mater. Trans., 2005, vol. 46, no. 11, pp. 2413–2418. https://doi.org/10.2320/matertrans.46.2413
4. Saleh, A.A., A comparative experimental study of hypoeutectic Sn–Zn solder alloys, Int. J. Mech. Eng. Technol., 2018, vol. 9, no. 6, pp. 909–915.
5. Liu, S., Xue, S., and Xue, P., Present status of Sn–Zn lead-free solders bearing alloying elements, J. Mater Sci.: Mater Electron., 2015, vol. 26, no. 7, pp. 4389–4411. https://doi.org/10.1007/s10854-014-2659-7
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献