Influence of small addition of antimony (Sb) on thermal behavior, microstructural and tensile properties of Sn-9.0Zn-0.5Al Pb-free solder alloy

Author:

El Basaty A.B.,Deghady A.M.,Eid E.A.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference48 articles.

1. Lead-free solders in microelectronics;Abtewa;Mater. Sci. Eng. R,2000

2. Handbook of Lead-Free Solder Technology For Microelectronic Assemblies;Puttlitz,2004

3. Resonant vibration of Sn-Zn-Ag solder alloys;Song;J. Alloy. Compd.,2004

4. Sn–Zn low temperature solder;Suganuma;J. Mater. Sci: Mater. Electron,2007

5. K.N. Subramanian, Lead-free electronic solders, A Special Issue of the J. Mater. Sci.: Mater Electron., Springer Science Business Media, LLC, 2007, pp. 191–210.

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