Transverse ultrafast laser inscription in bulk silicon-Reference-Cited by-同舟云学术

Transverse ultrafast laser inscription in bulk silicon

Published:2021-10-14 Issue:4 Volume:3 Page:
ISSN:2643-1564
Container-title:Physical Review Research
language:en
Short-container-title:Phys. Rev. Research

Author:

Chambonneau M.^ORCID,Blothe M.^ORCID,Li Q.^ORCID,Fedorov V. Yu.^ORCID,Heuermann T.,Gebhardt M.^ORCID,Gaida C.^ORCID,Tertelmann S.,Sotier F.,Limpert J.,Tzortzakis S.,Nolte S.^ORCID

Funder

Bundesministerium für Bildung und Forschung

Qatar National Research Fund

Deutsche Forschungsgemeinschaft

Publisher

American Physical Society (APS)

Subject

General Engineering

Link

http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevResearch.3.043037/fulltext

Reference68 articles.

1. Ultrafast laser direct writing and nanostructuring in transparent materials

2. In‐Volume Laser Direct Writing of Silicon—Challenges and Opportunities

3. Delocalization of femtosecond radiation in silicon

4. The effect of light-induced plasma on propagation of intense fs laser radiation in c-Si

5. Delocalization of femtosecond laser radiation in crystalline Si in the mid-IR range

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