Polyimides with low dielectric constants and dissipation factors at high frequency derived from novel aromatic diamines with bistrifluoromethyl pendant groups-Reference-Cited by-同舟云学术

Polyimides with low dielectric constants and dissipation factors at high frequency derived from novel aromatic diamines with bistrifluoromethyl pendant groups

Published:2023 Issue:33 Volume:14 Page:3862-3871
ISSN:1759-9954
Container-title:Polymer Chemistry
language:en
Short-container-title:Polym. Chem.

Author:

Zhang Yao¹²,Huang Shan¹²,Lv Xialei¹,Wang Kuangyu¹,Yin Huimin¹²,Qiu Siyao¹,Li Jinhui¹^ORCID,Zhang Guoping¹^ORCID,Sun Rong¹^ORCID

Affiliation:

1. Shenzhen International Innovation Institutes of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China

2. Department of Nano Science and Technology Institute, University of Science and Technology of China, Suzhou, 215123, China

Abstract

Fan-out wafer-level packaging (FOWLP) urgently demands low dielectric constant and dissipation factor interlayer dielectric materials to mitigate high transmission losses at high frequencies.

Funder

National Natural Science Foundation of China

Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences

Chinese University of Hong Kong

Publisher

Royal Society of Chemistry (RSC)

Subject

Organic Chemistry,Polymers and Plastics,Biochemistry,Bioengineering

Link

http://pubs.rsc.org/en/content/articlepdf/2023/PY/D3PY00773A

Reference37 articles.

1. Design and Reliability Assessment of Novel 3D-IC Packaging