Coupled self-assembled monolayer for enhancement of Cu diffusion barrier and adhesion properties-Reference-Cited by-同舟云学术

Coupled self-assembled monolayer for enhancement of Cu diffusion barrier and adhesion properties

Published:2014-11-04 Issue:104 Volume:4 Page:60123-60130
ISSN:2046-2069
Container-title:RSC Adv.
language:en
Short-container-title:RSC Adv.

Author:

Chung Yongwon,Lee Sanggeun,Mahata Chandreswar,Seo Jungmok,Lim Seung-Min,Jeong Min-su,Jung Hanearl,Joo Young-Chang,Park Young-Bae,Kim Hyungjun,Lee Taeyoon

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2014/RA/C4RA08134J

Reference43 articles.

1. Multilevel interconnections for ULSI and GSI era

2. Properties of TaNx films as diffusion barriers in the thermally stable Cu/Si contact systems

3. Formation of copper silicides from Cu(100)/Si(100) and Cu(111)/Si(111) structures

4. Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions

5. ZERO THICKNESS DIFFUSION BARRIERS AND METALLIZATION LINERS FOR NANOSCALE DEVICE APPLICATIONS

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