ZERO THICKNESS DIFFUSION BARRIERS AND METALLIZATION LINERS FOR NANOSCALE DEVICE APPLICATIONS
Author:
Publisher
Informa UK Limited
Subject
General Chemical Engineering,General Chemistry
Link
http://www.tandfonline.com/doi/pdf/10.1080/00986445.2011.576450
Reference95 articles.
1. Atomic layer deposition of noble metals: Exploration of the low limit of the deposition temperature
2. Ultra thin CVD TiN layers as diffusion barrier films on porous low-k materials
3. Deposition of barrier layer and CVD copper under no exposed wafer conditions: adhesion performance and process integration
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