Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor
Author:
Affiliation:
1. Institute of Innovative Mobility (IIMo)
2. Technische Hochschule Ingolstadt
3. 85049 Ingolstadt
4. Germany
5. Department of Chemical Sciences
6. University of Padova
7. 35131 Padova
8. Italy
9. ZESTRON-High Precision Cleaning
10. 85053 Ingolstadt
Abstract
Crystals of tin-oxides and tin-formates are grown from Sn–Ag–Cu alloy under formic acid vapour as used in the fluxless soldering process.
Publisher
Royal Society of Chemistry (RSC)
Subject
Materials Chemistry,General Chemistry,Catalysis
Link
http://pubs.rsc.org/en/content/articlepdf/2019/NJ/C9NJ02135C
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3. T. R. Bieler and T.Lee , Lead-free solder , Encyclopaedia of Materials: Science and Technology , Elsevier , 2nd edn, 2010 , pp. 1–12
4. A review of lead-free solders for electronics applications
5. Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic flux
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