Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor

Author:

Mokhtari Omid1234ORCID,Conti Fosca5678ORCID,Bhogaraju Sri Krishna1234ORCID,Meier Markus9104,Schweigart Helmut9104,Tetzlaff Ulrich1234,Elger Gordon1234

Affiliation:

1. Institute of Innovative Mobility (IIMo)

2. Technische Hochschule Ingolstadt

3. 85049 Ingolstadt

4. Germany

5. Department of Chemical Sciences

6. University of Padova

7. 35131 Padova

8. Italy

9. ZESTRON-High Precision Cleaning

10. 85053 Ingolstadt

Abstract

Crystals of tin-oxides and tin-formates are grown from Sn–Ag–Cu alloy under formic acid vapour as used in the fluxless soldering process.

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry,Catalysis

Reference32 articles.

1. Wafer Bonding: Applications and Technology , ed. M. Alexe and U. Gösele , Springer Series in Materials Science , Springer-Verlag , Heidelberg , 2004 , vol. 75

2. Heat and fluid flow in high-power LED packaging and applications

3. T. R. Bieler and T.Lee , Lead-free solder , Encyclopaedia of Materials: Science and Technology , Elsevier , 2nd edn, 2010 , pp. 1–12

4. A review of lead-free solders for electronics applications

5. Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic flux

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