In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere

Author:

He Siliang,Gao Runhua,Li Jiahui,Shen Yu-An,Nishikawa Hiroshi

Funder

SANYOSEIKO.,LTD

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Directional Atmospheric Plasma De-oxidation for Ultra Small Passive Component Assembly;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Solder joints on thick printed copper substrates;Power Electronic Devices and Components;2024-04

3. Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes;Journal of Welding and Joining;2023-10-31

4. Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies;Journal of Materials Research and Technology;2023-07

5. Thermal Shock Ageing of Joints Soldered Using Formic Acid Vapors on Thick Printed Copper Substrates;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

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