Thermal Shock Ageing of Joints Soldered Using Formic Acid Vapors on Thick Printed Copper Substrates
Author:
Affiliation:
1. University of West Bohemia,Faculty of Electrical Engineering,Department of Materials and Technology,Pilsen,Czech Republic
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10168303/10168312/10168336.pdf?arnumber=10168336
Reference7 articles.
1. Influence of thermal ageing on void content and shear strength for selected lead free solder die-attach
2. Sn- and Cu-oxide reduction by formic acid and its application to power module soldering
3. In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere
4. Thermomechanical Reliability Investigation of Carbon Nanotube Off-Chip Interconnects for Electronic Packages
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