Thermomechanical Reliability Investigation of Carbon Nanotube Off-Chip Interconnects for Electronic Packages-Reference-Cited by-同舟云学术

Thermomechanical Reliability Investigation of Carbon Nanotube Off-Chip Interconnects for Electronic Packages

Published:2022-08 Issue:8 Volume:12 Page:1282-1292
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Ginga Nicholas J.¹^ORCID,Sitaraman Suresh K.²^ORCID

Affiliation:

1. Mechanical and Aerospace Engineering Department, The University of Alabama in Huntsville (UAH), Huntsville, AL, USA

2. Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9868249/09844756.pdf?arnumber=9844756

Reference32 articles.

1. The beneficial effect of underfilling on the reliability of flip-chip joints

2. An investigation on thermal reliability of underfilled PBGA solder joints

3. Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability

4. Comparison of Sn-Ag-Cu Solder Alloy Intermetallic Compound Growth Under Different Thermal Excursions for Fine-Pitch Flip-Chip Assemblies

5. Waviness reduces effective modulus of carbon nanotube forests by several orders of magnitude

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