Low temperature and low pressure die-attach bonding of high power light emitting diodes with self reducing copper complex paste-Reference-Cited by-同舟云学术

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Low temperature and low pressure die-attach bonding of high power light emitting diodes with self reducing copper complex paste

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Bhogaraju Sri Krishna¹,Schmid Maximilian¹,Hufnagel Elias¹,Conti Fosca²,Kotadia Hiren R³,Elger Gordon⁴

Affiliation:

1. Institute of Innovative Mobility, Technische Hochschule Ingolstadt,Ingolstadt,Germany

2. University of Padova,Department of Chemical Sciences,Padova,Italy

3. WMG (Warwick Manufacturing Group), University of Warwick,London,United Kingdom

4. Fraunhofer IVI, Applied Research Center “Connected Mobility and Infrastructure”,Ingolstadt,Germany

Funder

German Federal Ministry of Education and Research

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501774.pdf?arnumber=9501774

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Nanoporous silver fabricated with pretreated Ag–Al alloy toward surface enhanced Raman sensing;Nanotechnology;2024-05-23

2. Investigation Of Stress Generated By Interconnection Processes With Micro-Raman Spectroscopy (μRS);2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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