Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages
Author:
Affiliation:
1. Heller Korea, Ltd,Suwon,Rep of Korea
2. Indium Corporation,Clinton,NY,USA
3. Heller Industries,Florham Park,NJ,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816406.pdf?arnumber=9816406
Reference21 articles.
1. Effect of Oxidation on Indium Solderability
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4. Decomposition of formic acid;martin;Phys Chem Phys,2011
5. Voids in Solder Joints;aspandiar;SMTA Boise Expo and Tech Forum,2018
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1. Experimental investigation on optimization of the performance of gallium-based liquid metal with high thermal conductivity as thermal interface material for efficient electronic cooling;International Journal of Heat and Mass Transfer;2024-07
2. Thermal Performance of an Indium-Silver Alloy Metal TIM for a Large Body Lidded FCBGA After EOL and Long-term Reliability Tests;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
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