Surface chemistry of copper metal and copper oxide atomic layer deposition from copper(ii) acetylacetonate: a combined first-principles and reactive molecular dynamics study-Reference-Cited by-同舟云学术

Surface chemistry of copper metal and copper oxide atomic layer deposition from copper(ii) acetylacetonate: a combined first-principles and reactive molecular dynamics study

Published:2015 Issue:40 Volume:17 Page:26892-26902
ISSN:1463-9076
Container-title:Physical Chemistry Chemical Physics
language:en
Short-container-title:Phys. Chem. Chem. Phys.

Author:

Hu Xiao¹²³⁴,Schuster Jörg⁵³⁴,Schulz Stefan E.¹²³⁴⁵,Gessner Thomas¹²³⁴⁵

Affiliation:

1. Technische Universität Chemnitz

2. Center for Microtechnologies

3. Chemnitz

4. Germany

5. Fraunhofer Institute for Electronic Nano Systems

Abstract

Atomistic mechanisms for the atomic layer deposition using the Cu(acac)₂ (acac = acetylacetonate) precursor are studied using first-principles calculations and reactive molecular dynamics simulations.

Publisher

Royal Society of Chemistry (RSC)

Subject

Physical and Theoretical Chemistry,General Physics and Astronomy

Link

http://pubs.rsc.org/en/content/articlepdf/2015/CP/C5CP03707G

Reference76 articles.

1. Copper Metallization for High Performance Silicon Technology

2. Atomic Layer Deposition of Copper Seed Layers

3. Improved Step Coverage of Cu Seed Layers by Magnetic-Field-Assisted Ionized Sputtering

4. Atomic Layer Deposition: An Overview

5. Surface chemistry of atomic layer deposition: A case study for the trimethylaluminum/water process

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