Thiol–ene photo-curable hybrid silicone resin for LED encapsulation: enhancement of light extraction efficiency by facile self-keeping hemisphere coating
Author:
Affiliation:
1. School of Chemistry & Chemical Engineering
2. State Key Laboratory for Metal Matrix Composite Materials
3. Shanghai Jiao Tong University
4. Shanghai 200240, People's Republic of China
Abstract
Encapsulation with polymer materials can not only protect LED chips, but also enhance light extraction efficiency (LEE), and thus it has become necessary for the fabrication of LED devices.
Publisher
Royal Society of Chemistry (RSC)
Subject
Materials Chemistry,General Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2014/TC/C4TC00350K
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