Phase diagram and structural evolution of tin/indium (Sn/In) nanosolder particles: from a non-equilibrium state to an equilibrium state-Reference-Cited by-同舟云学术

Phase diagram and structural evolution of tin/indium (Sn/In) nanosolder particles: from a non-equilibrium state to an equilibrium state

Published:2017 Issue:34 Volume:9 Page:12398-12408
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Shu Yang¹²³⁴⁵,Ando Teiichi⁶⁷⁸⁵,Yin Qiyue⁹¹⁰¹¹⁵,Zhou Guangwen⁹¹⁰¹¹⁵^ORCID,Gu Zhiyong¹²³⁴⁵^ORCID

Affiliation:

1. Department of Chemical Engineering

2. University of Massachusetts Lowell

3. One University Ave

4. Lowell

5. USA

6. Department of Mechanical and Industrial Engineering

7. Northeastern University

8. Boston

9. Department of Mechanical Engineering & Multidisciplinary Program in Materials Science and Engineering

10. State University of New York

11. Binghamton

Abstract

Tin/indium (Sn/In) nanosolder particles, synthesized by a surfactant-assisted chemical reduction method at room temperature, were not in an equilibrium state; however, the equilibrium state was effectively attained through post-synthesis heat treatment.

Funder

Division of Civil, Mechanical and Manufacturing Innovation

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2017/NR/C7NR01402C

Reference42 articles.

1. Electronics Manufacturing: With Lead-free, Halogen-Free, and Conductive-Adhesive Materials, ed. J. Lau, C. P. Wong, N. C. Lee and S. W. R. Lee, McGraw Hill, New York, 2002

2. Electronics Without Lead

3. Six cases of reliability study of Pb-free solder joints in electronic packaging technology

4. A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products

5. Advances in lead-free electronics soldering

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