1-(4-Hydroxyphenyl)-2<i>H</i>-tetrazole-5-thione as a leveler for acid copper electroplating of microvia-Reference-Cited by-同舟云学术

1-(4-Hydroxyphenyl)-2H-tetrazole-5-thione as a leveler for acid copper electroplating of microvia

Published:2022 Issue:25 Volume:12 Page:16153-16164
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Teng Xulingjie¹^ORCID,Tao Zhihua¹^ORCID,Long Zhiyuan¹,Liu Guanting¹,Tao Xuefei²

Affiliation:

1. Department of Applied Chemistry, School of Materials and Energy, University of Electronic Science and Technology of China (UESTC), Chengdu, 610054, China

2. Jiangxi Vocational College of Finance and Economics, Jiujiang, 332000, China

Abstract

Microvia filling by copper electroplating was performed using plating solution with 1-(4-hydroxyphenyl)-2H-tetrazole-5-thione (HPTT) as the leveler.

Funder

Natural Science Foundation of Jiangxi Province

National Natural Science Foundation of China

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2022/RA/D2RA02274E

Reference42 articles.

1. Optimization of the Copper Plating Process Using the Taguchi Experimental Design Method

2. Investigation of suppressor polyethylene glycol dodecyl ether on electroplated Cu filling by electrochemical method

3. Tetrazole Derived Levelers for Filling Electroplated Cu Microvias: Electrochemical Behaviors and Quantum Calculations

4. Computational analysis and experimental evidence of two typical levelers for acid copper electroplating

5. Investigation of Nitrogen Heterocyclic Compounds as Levelers for Electroplating Cu Filling by Electrochemical Method and Quantum Chemical Calculation

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