Five-membered heterocyclic small molecule compounds as novel levelling agents for blind-hole copper plating-Reference-Cited by-同舟云学术

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Five-membered heterocyclic small molecule compounds as novel levelling agents for blind-hole copper plating

Published:2024-03 Issue: Volume:956 Page:118100
ISSN:1572-6657
Container-title:Journal of Electroanalytical Chemistry
language:en
Short-container-title:Journal of Electroanalytical Chemistry

Author:

Zhang Tao,Zheng Chaojie,Li Haidi,Song Shiqi,Huang Wei,Li Qiaoxia,Min Yulin,Shen Xixun,Xu Qunjie

Funder

National Natural Science Foundation of China

Science and Technology Commission of Shanghai Municipality

Publisher

Elsevier BV

Reference39 articles.

1. A synergy effect of 2-MBT and PE-3650 on the bottom-up filling in electroless copper plating;Zan;Electrochem. Solid St.,2011

2. Copper electroplating of PCB interconnects using megasonic acoustic streaming;Jones;Ultrason. Sonochem.,2018

3. A Wideband PCB-Stacked Air-Filled Luneburg Lens Antenna for 5G Millimeter-Wave Applications;Wang;IEEE Antennas Wirel. Propag. Lett.,2021

4. Transitional Additive Adsorption with Co-Addition of Suppressor and Leveler for Copper TSV Filling;Tomie;J. Electrochem. Soc.,2020

5. Influence of SPS Decomposition Product 1,3-Propane Disulfonic Acid on Electrolytic Copper Via Filling Performance;Kimizuka;J. Electrochem. Soc.,2015

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of azathioprine and its local-structure molecules as levelers for through-holes copper electroplating;Surfaces and Interfaces;2024-10

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