Five-membered heterocyclic small molecule compounds as novel levelling agents for blind-hole copper plating
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering,Analytical Chemistry
Reference39 articles.
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4. Transitional Additive Adsorption with Co-Addition of Suppressor and Leveler for Copper TSV Filling;Tomie;J. Electrochem. Soc.,2020
5. Influence of SPS Decomposition Product 1,3-Propane Disulfonic Acid on Electrolytic Copper Via Filling Performance;Kimizuka;J. Electrochem. Soc.,2015
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