Chemical bonding and Cu diffusion at the Cu/Ta2N interface: a DFT study
Author:
Affiliation:
1. College of Mechanics and Materials
2. Hohai University
3. Nanjing 210098
4. P. R. China
5. Department of Physics
6. China University of Mining and Technology
7. Xuzhou 221116
Abstract
DFT calculations were performed to study chemical bonding and Cu diffusion at the Cu/Ta2N interface.
Funder
National Natural Science Foundation of China
Publisher
Royal Society of Chemistry (RSC)
Subject
Physical and Theoretical Chemistry,General Physics and Astronomy
Link
http://pubs.rsc.org/en/content/articlepdf/2018/CP/C8CP01839A
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1. Recent advances on electromigration in very-large-scale-integration of interconnects
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