A Novel laser scanning method for metallization of alumina substrate by copper-Reference-Cited by-同舟云学术

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A Novel laser scanning method for metallization of alumina substrate by copper

Published:2022-12-09 Issue:3 Volume:42 Page:844-852
ISSN:1001-0521
Container-title:Rare Metals
language:en
Short-container-title:Rare Met.

Author:

Hui Yu,Na Zhao-Lin^ORCID,Sun Bo-Ming,Sun Xu-Dong,Chen Jia-Lin^ORCID

Funder

The Fund of the State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals

National Natural Science Foundation of China

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics

Link

https://link.springer.com/content/pdf/10.1007/s12598-022-02157-0.pdf

Reference48 articles.

1. Gruber M, Supancic P, Aldrian F, Bermejo R. Effect of metallization on the strength and fracture behaviour of functional co-fired multilayer ceramics. J Eur Ceram Soc. 2017;37(14):4389. https://doi.org/10.1016/j.jeurceramsoc.2017.02.018.

2. Bai JG, Zhang ZZ, Calata JN, Lu GQ. Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material. IEEE Trans Compon Packag Technol. 2006;29(3):589. https://doi.org/10.1109/TCAPT.2005.853167.

3. Lu XY, Hua TC, Liu MJ, Cheng YX. Thermal analysis of loop heat pipe used for high-power LED. Thermochim Acta. 2009;493(1–2):25. https://doi.org/10.1016/j.tca.2009.03.016.

4. Zhang Y, Dai J, Bai G, Zhang H. Microstructure and thermal conductivity of AlN coating on Cu substrate deposited by arc ion plating. Mater Chem Phys. 2020;241:122374. https://doi.org/10.1016/j.matchemphys.2019.122374.

5. Jang K, Mhin S, Lim S, Song Y, Lee K, Park S, Moon K, Lee S, Hyun SJ. Room temperature bonding on interface between metal and ceramic. J Electron Mater. 2019;48(1):72. https://doi.org/10.1007/s11664-018-6693-8.

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