Effects of organic additives on the immersion gold depositing from a sulfite–thiosulfate solution in an electroless nickel immersion gold process
Author:
Affiliation:
1. School of Marine Science and Technology
2. Harbin Institute of Technology
3. Weihai 264209
4. China
5. School of Materials Science and Engineering
Abstract
An immersion gold-plating process on electroless Ni–P alloy substrate was investigated.
Publisher
Royal Society of Chemistry (RSC)
Subject
General Chemical Engineering,General Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2016/RA/C5RA17975K
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1. Major factors to the solder joint strength of ENIG layer in FC BGA package
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3. Electrodeposited Ni microcones with a thin Au film bonded with Au wire
4. Gold Immersion Deposition on Electroless Nickel Substrates
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