Electrodeposited Ni microcones with a thin Au film bonded with Au wire-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Electrodeposited Ni microcones with a thin Au film bonded with Au wire

Published:2014-02 Issue:2 Volume:214 Page:326-333
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Gao Shixin,Chen Zhuo,Hu Anmin,Li Ming,Qian Kaiyou

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference15 articles.

1. A brief review of selected aspects of the materials science of ball bonding;Breach;Microelectronics Reliability,2010

2. The effect of modifications to the nickel/gold surface finish on assembly quality and attachment reliability of a plastic ball grid array;Coyle;IEEE Transactions on Components and Packaging Technologies,2003

3. Wire-bonding on printed circuit boards;Falk;Circuit World,1994

4. Autocatalytic gold plating process for electronic packaging applications;Gaudiello,1995

5. Characterization of nickel nanocones routed by electrodeposition without any template;Hang;Nanotechnology,2008

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Effect of Thermal Aging on the Mechanical Properties of Gold-Containing Solder Joints;Journal of Electronic Materials;2024-06-28

2. Electrodeposited Palladium Coating on Co Micro-Nano Cones Array for Low-Temperature Solid-State Bonding;Electronic Materials Letters;2023-09-25

3. Electrodeposited Ternary CuNiMo Catalysts for Alkaline Hydrogen Oxidation;Electronic Materials Letters;2023-09-10

4. Novel lead-connection technology for thin-film temperature sensors with arbitrary electrode lengths;Measurement Science and Technology;2023-03-16

5. Insights into the DMH tautomeric structures and its effects on the electro-reduction of Au(DMH)4− coordination ions;Electrochimica Acta;2023-01

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3