Electrodeposited Palladium Coating on Co Micro-Nano Cones Array for Low-Temperature Solid-State Bonding
Author:
Funder
the National Natural Science Foundation of China
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s13391-023-00462-z.pdf
Reference24 articles.
1. Sun, L., Chen, M.H., Zhang, L., He, P., Xie, L.S.: Recent progress in SLID bonding in novel 3D-IC technologies. J. Alloy Compd. 818, 152825 (2020). https://doi.org/10.1016/j.jallcom.2019.152825
2. Bower, C.A., Malta, D., Temple, D., Robinson, J.E., Coffinan, P.R., Skokan, M.R., Welch, T.B.: High density vertical interconnects for 3-D integration of silicon integrated circuits. 56th Electronic Components and Technology Conference (2006). (2006) https://doi.org/10.1109/ECTC.2006.1645677
3. Gao, S., Chen, Z., Hu, A., Li, M., Qian, K.: Electrodeposited Ni microcones with a thin au film bonded with au wire. J. Mater. Process. Technol. 214, 326–333 (2014). https://doi.org/10.1016/j.jmatprotec.2013.09.017
4. Chuan Seng, T.: Application of self-assembled monolayer (SAM) in low temperature bump-less Cu-Cu bonding for advanced 3D IC. 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (2010). https://doi.org/10.1109/IMPACT.2010.5699478
5. Tan, C.S., Lim, D.F., Ang, X.F., Wei, J., Leong, K.C.: Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement. Microelectron. Reliab. 52, 321–324 (2012). https://doi.org/10.1016/j.microrel.2011.04.003
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