Electroless deposition of Ni–P/Au coating on Cu substrate with improved corrosion resistance from Au(iii)–DMH based cyanide-free plating bath using hypophosphite as a reducing agent-Reference-Cited by-同舟云学术

Electroless deposition of Ni–P/Au coating on Cu substrate with improved corrosion resistance from Au(iii)–DMH based cyanide-free plating bath using hypophosphite as a reducing agent

Published:2021 Issue:62 Volume:11 Page:39153-39168
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Wu Bo¹^ORCID,Tan Baizhao¹,Tan Guizhen¹,Zeng Ming¹,Luo Jinyi¹,Hu Guanghui¹,Luo Jiye¹^ORCID,Hao Zhifeng¹^ORCID,Lai Shaomei²,Liu Binyun²

Affiliation:

1. Guangdong Provincial Key Laboratory of Plant Resources Biorefinery, School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou 510006, China

2. Guangdong Toneset Science & Technology Co., Ltd, Guangzhou 511400, China

Abstract

In the Au(iii)–DMH based cyanide-free electroless gold plating bath, the added hypophosphite inhibited the black pad and improved the corrosion resistance of the Cu/Ni–P/Au coating.

Funder

National Natural Science Foundation of China

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2021/RA/D1RA07952B

Reference75 articles.

1. Cu/Ni/Au multilayers by electrochemistry: A crucial system in electronics - A critical review

2. A comparative assessment of gold plating thickness required for stationary electrical contacts

3. Enhancing the corrosion resistance of Cu/Ni-P/Au electrical contacts by electropolymerized poly(methyl methacrylate)

4. Atmospheric corrosion resistance of electroplated Ni/Ni–P/Au electronic contacts

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhancing air stability and conductivity of cotton fabrics through dual-metal electroless deposition;Journal of Materials Science;2024-06-16

2. Multifaceted insights into Au coatings electrodeposited from a ChCl-EG based Deep Eutectic Solvent (DES): Unravelling the effect of surfactant polarity and current density on the morphology, mechanical properties, and anti-tarnishing efficacy;Surfaces and Interfaces;2024-06

3. Study on the preparation mechanism and property analysis of a localized Au coating by laser-induced cyanide-free electroplating;Journal of Materials Science: Materials in Electronics;2024-05

4. Recycling Cu(II) from complexing copper wastewater using ferrous sulfide stabilized by carboxymethyl cellulose: efficiency and mechanism insights;Separation and Purification Technology;2024-02

5. Multifaceted Insights into AU Coatings Electrodeposited from a Chcl-Eg Based Deep Eutectic Solvent (Des): Unravelling the Effect of Surfactant Polarity and Current Density on the Morphology, Mechanical Properties, and Anti-Tarnishing Efficacy;2024