Atmospheric corrosion resistance of electroplated Ni/Ni–P/Au electronic contacts-Reference-Cited by-同舟云学术

Atmospheric corrosion resistance of electroplated Ni/Ni–P/Au electronic contacts

Published:2016-05 Issue: Volume:60 Page:84-92
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Murugan Vinod K.,Jia Zhigang,Syaranamual Govindo J.,Gan Chee Lip,Huang Yizhong,Chen Zhong

Funder

Economic Development Board (EDB), Singapore

Nanyang Technological University, Singapore

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference42 articles.

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3. Diffusion of copper into gold plating;Pucic,1993

4. Diffusion problems in microelectronic packaging;Hall;Thin Solid Films,1978

5. Fundamentals of Electrochemical Deposition;Paunovic,2006

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