Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference15 articles.
1. Goyal D, Lane T, Kinzie P, Panichas C, Chong KM, Villalobos O. Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold interface. In: Electronic components and technology conference proceeding 52nd, 2002. p. 732–9.
2. Coyle RJ, Ejim TI, Holliday A, Dorey JK. Reliability performance and failure mode of high I/O thermally enhanced ball grid array packages. In: Electronics manufacturing technology symposium, twenty-third IEEE/CPMT, 1998. p. 323–32.
3. Afraid of the dark?;Champaign;Circ Assembly,2003
4. Kuldip Johal. Phosphorous in electroless nickel layer—curse or blessing? IPC Expo. APEX and designers summit trade show held in Anaheim, CA, Feb 2004.
5. Spalling behaviors of intermetallic compounds during the wetting reaction of Sn(3.5Ag) on electroless Ni–P metallization;Sohn;ECTC Proceeding,2004
Cited by
23 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献